The Scientific Technical Committee Precision Engineering and Metrology (STC P) had two meetings in 2023 – on February 23 and August 25, 2023.  The February meeting was held in Paris, attended by 63 members and 10 invited guests. The August meeting was held in Dublin, Ireland, attended by 49 members and 14 invited guests.

During the February 2023 meeting STC P discussed the status of the future keynote papers, which were decided in the previous meetings, based on the general trends in manufacturing influencing the STC P scope of activities.  Since keynote papers until 2026 were already decided, there were no new proposals for a keynote paper beyond this date.

Following the guidance of the CIRP Council, STC P Board invited one well-known industrial researcher to provide his companies’ perspectives on metrology for semiconductor industry.  During this topical session, introduced by Prof. Takaya, Dr. L. Redlarski, Senior Manager at Mitutoyo Research Center Europe presented a talk entitled, “Applied measurement technology for the semiconductor industry”.

As expected, covering hot topics, including an introduction to Mitutoyo RCE, an overview of the semiconductor industry, inspection technologies from Mitutoyo, examples of applications and challenges using white light interferometry (WLI), a perspective on trends and future needs, followed by a summary, stimulated a significant level of interest and discussion among the meeting attendees.  Those discussions were well summarized in the minutes of the meeting.

Prof. R. Schmidt introduced the new CIRP publication series, CIRP Novel Topics in Production Engineering (CNPTE) to the attendees and welcomed proposed topics from STC P. In the beginning the presentation, the subject of the current CIRP dictionaries was presented as a motivation for having a method of introduction of new ideas.

There were two short technical presentations followed by short discussions:

1. Quality control of metal welding by 3D-Machine Vision automatic measurement of surface defects (M. Galetto, G. Genta, and G. Maculotti)
2. Performance comparison of on-machine and off-machine optical tool presetting systems (A. Shaheen, N. Nielsen, and G. Bissacco)

Information on relevant ISO/TC213 and ISO/TC39 standards were provided by Dr. A. Balsamo and Dr. A. Donmez, respectively.  These were followed by the updates from CWG-AI and CWG-Bio meetings.

Finally, A. Archenti announced the call for reviewers for CIRP Journal, future keynote speakers, and proposed topics for focused discussions.

During the August 2023 meeting, STC P thanked Prof. G. Goch and his co-authors for preparing and presenting 2023 STC P Keynote paper, “Gear metrology – An update.” The paper was presented by Prof. Goch during CIRP GA STC-P part 1 meeting on August 21^nd in Dublin, which generated significant interest by CIRP members.  STC P also discussed the status of future keynote papers providing inputs to the corresponding keynote authors.

STC P Board invited one well-known industrial researcher to provide his companies’ perspectives on metrology for aerospace industry.  During this topical session, introduced by Prof. Archenti, R. Lindqvist, SAAB Aeronautics, Sweden presented a talk entitled, “Large volume dimensional metrology in the Aerospace industry”.

The following short technical presentations were given during the meeting, followed by short discussions:

3. Non-destructive nanoscale heat detection with a thermal near-field microscope by Yusuke Kajihara
4. Deep learning-based segmentation of surface defects for myopia control spectacle lenses by Benny C.F. Cheung
5. New nano probes for the measurement of nanostructures with large aspect ratio by Shuming Yang
6. Ultra-precision Turning of Freeform Fresnel Optics with Adaptive 4-axis Tool Path Planning by Ping Guo
7. Deep-Learning based Methods in Photogrammetry: A Case Study on Synthetic Stereo Vision Images of a Metrological Artifact" by Benjamin Montavon
8. Improved sensitivity for subsurface imaging by ultrasonic atomic force microscope using asymmetric contact resonance by Yuan-Liu Chen
   
   

STC P paper session was held on Monday and Tuesday, August 21-22, 2023. There were 7 technical presentations covering various research topics, including high-precision gear machining metrology, kinematic models for articulated coordinate measuring arm, on-machine tool coordinate measurement, sensor integration, in-process measurements, metasurface-based sensors, and accuracy improvement in instrumented indentation tests. They were all well presented by the authors and generated lively discussions during the session.

Andreas Archenti
STC P Chairman

November 1, 2023