THE INTERNATIONAL ACADEMY FOR PRODUCTION ENGINEERING
LOG IN FOR MEMBERS
CIRP Annals Online sorted by Year and Volume |
CIRP ANNALS 1993 |
GO TO STC: A C Dn E F G M O P S Cross-STC |
STC A |
| A key issue in product life cycle : disassembly |
| F. Jovane (1), L. Alting (1), A. Armillotta, W. Eversheim (1), K. Feldmann (2), G. Seliger (2), N. Roth (2) |
| STC A, 42/2/1993, P.651 |
| Keywords: Assembly, Disassembly, Recycling |
|
Abstract : Incoming environmental legislation is expected to impose recycling
activities on industrial and consumer product manufacturers. Disassembly
of used products is needed in order to make recycling economically
viable in the current state of the an of reprocessing technology, thus
avoiding the future high disposal costs. This paper gives an overview of
disassembly research at universities, research centers and industrial
companies, pointing out ongoing topics and trends for future activities.
Among them, major attention has been paid to basic technological
development, product design (design for disassembly), process design
(selection of disassembly strategy and automation level) and system
design (configuration of manual and automated disassembly facilities,
design of disassembly tools). It is also shown how the emerging life
cycle concept can be fully exploited to develop suitable ways of dealing
with information related to environmental protection and resource
optimization. A result of the survey is that further development on
disassembly of existing products (technology, planning at process and
system level) is needed to allow future products to be designed with
recycling considerations in mind. |
STC C |
| Recent developments in chip control research and applications |
| I.S. Jawahir (2), C.A. Van Luttervelt (1) |
| STC C, 42/2/1993, P.659 |
| Keywords: Chip Formation, Chips, Chip Control, Chip Breakers, Chip Removal |
|
Abstract : During the 1990 CIRP General Assembly in Berlin a working group on Chip Control
was formed within the STC -"Cutting", with a view to evaluating
and sharing the present knowledge on chip formation and chip control and
promoting new research in this area. To date, about 40 researchers have
made more than 60 contributions at six chip control working group
meetings. Among these presentations, several contributions really
provided fresh insights dealing with new and innovative research
methods. The working group also provided a framework for international
cooperative work, enabling exchange of information and coordinated
research collaboration. The group placed a greater emphasis on the
practical value of knowledge on chip control for industrial
applications. This paper presents the major results of this cooperative
work covering modeling of the chip formation process for chip flow; curl
and breaking; means of chip breaking, including experimental as well as
the knowledge-based systems approach; and a summary of future directions
in research and applications. |
STC Dn |
| Product modelling |
| F.L. Krause (2), F. Kimura (2), T. Kjellberg (2), S.C.Y. Lu (2), L. Alting (1), H.A. ElMaraghy (1), W. Eversheim (1), K. Iwata (1), N.P. Suh (1), V.A. Tipnis (2), M. Weck (1) |
| STC Dn, 42/2/1993, P.695 |
| Keywords: Computer-Aided Design, Product Development, Modeling |
|
Abstract : One of the most challenging tasks in the engineering profession is to
develop new products that have the shortest lead-time. highest quality
and lowest cost with optimal life-cycle consideration. The issue of
product modeling is at the center of various new product development
paradigms designed to meet this challenge, and, therefore, has received
major attentions from application and research communities. Due to the
fast developments of computer and information technologies and the
increasing demands of competitiveness and productivity, the scopes and
approaches of product modeling have evolved rapidly in recent years.
This paper presents an overview of the state-of-the-art and practice of
product modeling in terms of product models and process chains, and
suggests some important issues for further investigation. |
STC E |
| Advanced techniques for die and mold manufacturing |
| T. Altan (1), B.W. Lilly, J.P. Kruth (1), W. Koenig (1), H.K. Toenshoff (1), C.A. Van Luttervelt (1) |
| STC E, 42/2/1993, P.707 |
| Keywords: Die, Mold |
|
Abstract : Die and mold manufacturing represents a significant area of production
technology since it influences the feasibility and economics of
producing a very large number of discrete components. Modern die
manufacturing includes just about all aspects of manufacturing: part
design, geometry handling and transfer, die design. process modeling,
prototype production, control of dimensional and surface quality as well
as advanced mechanical, electrical, and electrochemical machining
methods. This paper, prepared with input from various CIRP colleagues,
attempts to review the latest advances and practical applications in the
field |
STC F |
| Recent development in auto-body panel forming technology |
| T. Nakagawa (1) |
| STC F, 42/2/1993, P.717 |
| Keywords: Sheet Metal, Formability, Deep Drawing, Forming Techniques, Laser Beam Welding, Simulation |
|
Abstract : Auto-body panel forming is one of the most important manufacturing
processes in automotive industry. Intensive efforts have been made
continuously for the improvement of panel quality and productivity and
for the reduction of manufacturing cost. Forming process itself does not
change so much but the whole panel manufacturing system is gradually
changing by introducing the surrounding advanced technologies. This
paper deals with the recent innovative developments in the fields of
forming materials, blank preparation, control of forming conditions,
forming tool design and manufacturing and computer simulation of forming
process. Contributions for preparing this survey are received from T.
Altan, E. Doege, M. Geiger, K. Lange and A. Schey. The author would like
to extend his sincere gratitude to automotive industries, Toyota, Nissan
and Honda for their valuable contributions to prepare the paper. |
STC G |
| Abrasive machining in the future |
| I. Inasaki (1), H.K. Toenshoff (1), T.D. Howes (2) |
| STC G, 42/2/1993, P.723 |
| Keywords: Abrasives, Grinding, Grinding Wheels, Grinding Fluids, Machine Tools |
|
Abstract : Although abrasive machining is a centuries-old technology, it continues
to play an important role in industry. The extremely small scale of
chips produced and the self-sharpening of grinding wheels are key
advantages of abrasive machining and should be taken advantage of in
future efforts to develop abrasive machining technologies. The most
recent developments in abrasive machining are reviewed pointing out
problems to be solved for their practical applications in the near
future. Developing technologies reviewed in the paper relate to 1.
technologies for making abrasive grinding wheels, 2. high-precision
machining, 3. heavy-duty machining, 4. implementation of intelligent
abrasive machining, 5. use of computer simulation to understand abrasive
processes, and 6. environmental aspects of abrasive processes. It is
concluded that promising abrasive technologies of the future should
include grinding wheels with ultrafine grits, molecular dynamics surface
integrity assessment techniques, high-speed abrasive machining with CBN,
autonomous machining system implementing intelligent control and
advanced monitoring systems, and coolant free grinding. |
STC M |
| High speed machining |
| J. Tlusty (1) |
| STC M, 42/2/1993, P.733 |
| Keywords: Machining, Machine Tools, High Speed |
|
Abstract : Applications of High Speed Milling to face milling of cast iron with
silicon nitride tools, to end milling of aluminum aircraft structures,
to end milling of titanium fan blades and to end milling of hardened
steel dies are described. A case of High Speed Grinding of gears is also
introduced. The problem of loss of Process Damping is dealt with as well
as the use of spindle speed regulation for improving stability. The
various aspects of HST discussed are the spindle and guideway design,
feed drives for fast cornering, lightweight structures. |
STC O |
| Evolution and future perspectives of CAPP |
| H.A. ElMaraghy (1) |
| STC O, 42/2/1993, P.739 |
| Keywords: Computer-Aided Process Planning, Computer Integrated Manufacturing, Product/Process Modelling and Planning |
|
Abstract : Modem manufacturing is characterized by low volume, high variety
production and close tolerance high quality products. Computer
Integrated Manufacturing (CIM) is recognized as an effective platform
for increasing manufacturing competitiveness. Computer Aided Process
Planning is an essential key for achieving CIM. The integration of
design, computer aided process planning (CAPP) and production planning
and control (PPC) is becoming essential especially in a concurrent
engineering environment where many product life cycle factors are of
concern. An overview of the major development thrust in CAPP is
presented along with some of the evolving trends and challenges such as
rapid, generic, dynamic and/or distributed process planning. Related
issued of quality and evolving standards are also discussed. |
STC P |
| Scales vs laserinterferometers - Performance and comparison of two measuring systems |
| H. Kunzmann (1), T. Pfeifer, J. Flaegge |
| STC P, 42/2/1993, P.753 |
| Keywords: Accuracy, Displacement Measurements, Gratings, Laser Interferometers |
|
Abstract : Scales and laser interferometers both are linear displacement measuring
systems (LBS). It is the performance of the LBS that limits the accuracy
of servo-positioning machine tools and/or measuring instruments. The
traditional systems for this purpose (besides lead-screws) have been
graduated scales. Since the invention of the Here gasser
laserinterferometry has been an attractive alternative to scales. The
performance of both systems are partially very similar, partially very
different. In this paper metrology relevant capabilities of both systems
are described and compared. |
STC S |
| Low pressure synthesis of diamond coatings |
| H.E. Hintermann (1), A.K. Chattopadhyay |
| STC S, 42/2/1993, P.769 |
| Keywords: Surfaces, Diamond Coatings, Manufacturing Processes |
|
Abstract : In part 1 of this paper a concise r351sum351 is given on the present
understanding of the reigning mechanisms of COD low pressure diamond
synthesis, in particular of nucleation and early growth. The formation
and involvement of atomic hydrogen and hydro255carbon radicals is
essential for growing diamond films; they are the determining active and
interactive species. In part 2 the po255tential of COD diamond in
mechanical, especially tool applications, is treated. A state-of-the-art
overview of current industrial uses, capabilities and limitations of COD
diamond products is presented and discussed. Part 3 deals with an
entirely new applica255tion of COD diamond with definite industrial
potential, i.e. with thin film diamond sensors. The feasibility of such
devices has been shown; nevertheless, to make the product commercially
viable, depends on the successful development of an industrially
economic process technology - hence, presents a strong CIRP related
challenge. |